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Rubin Build-Out 100 · Sector S7 · Layer 3 · Assembly & Test

Advanced Packaging & Bonding

CoWoS, hybrid bonding, and chiplet integration. The packaging bottleneck the Rubin thesis is built around.

Equal-weight — 1d —
Cap-weighted — 1d —
Momentum (drift) — 1d —
Constituents — in this sector

Composite Index — since inception (Dec 30, 2025)

Three weighting variants of the same constituent basket, rebased to 1,000 at inception. EW = ticker-equal-weight with quarterly drift. CW = cap-weighted (10% cap; below ten names the cap is infeasible, so the sub-index is equal weight by construction) with semi-annual rebalance. MW = drift-only (1/N at inception, market does the tilting between rebalances). Click a legend entry to toggle its line.

Constituents

Every Rubin constituent tagged into this sector. Click a row to open the stock detail page with full chart + Money-Temperature scoring.

Ticker Company Region Last 1d 1w 1m 3m 6m 1y CCY
042700.KSHanmi SemiconductorKorea267000.00+0.95%+4.09%+16.09%+17.88%+4.30%+187.37%KRW
KLICKulicke & SoffaUS92.01+1.20%-8.69%+10.90%-13.60%+18.78%+127.63%USD
LPK.DELPKF Laser & ElectronicsEurope14.20+1.07%-16.47%+10.08%-15.98%+38.54%+102.28%EUR
NDSNNordsonUS328.17+0.40%-1.61%+6.74%+14.51%+19.21%+40.97%USD
BESI.ASBESIEurope179.45-0.25%-12.38%-2.53%-28.68%-17.01%+28.53%EUR
0522.HKASMPTAsia-other161.30-1.53%-6.76%-4.56%-13.00%+46.24%+102.77%HKD

FAQ · from the current data · as of 2026-10-09

Advanced Packaging & Bonding — data Q&A

What is the Advanced Packaging & Bonding sub-index of the Rubin Build-Out 100?

6 constituents, listed across Europe, Asia-other, Korea, US, computed equal-weight, cap-weight and momentum-weight from the same basket and rebased to 1,000 at the index base date. Part of the Rubin Build-Out 100 — /indices/rubin/.

Which Advanced Packaging & Bonding constituents lead and lag over one month?

As of 2026-10-09: leading — Hanmi Semiconductor (042700.KS) +16.09%; Kulicke & Soffa (KLIC) +10.90%; LPKF Laser & Electronics (LPK.DE) +10.08%. Lagging — ASMPT (0522.HK) -4.56%; BESI (BESI.AS) -2.53%; Nordson (NDSN) +6.74%. Returns are close-to-close in each name's trading currency.

Which Advanced Packaging & Bonding names have done best over one year?

As of 2026-10-09: Hanmi Semiconductor (042700.KS) +187.37%; Kulicke & Soffa (KLIC) +127.63%; ASMPT (0522.HK) +102.77%. Weakest: BESI (BESI.AS) +28.53%; Nordson (NDSN) +40.97%; LPKF Laser & Electronics (LPK.DE) +102.28%.

How often does this sub-index update, and is it advice?

The worker recomputes the sub-index and every constituent's returns after each US close (prices converted to USD for the index level; per-name returns stay in local currency). This page is a data surface in an investment research diary — it describes constituents and returns, it recommends nothing.