Rubin Build-Out 100 · Sector S7 · Layer 3 · Assembly & Test

Advanced Packaging & Bonding

CoWoS, hybrid bonding, and chiplet integration. The packaging bottleneck the Rubin thesis is built around.

Equal-weight 1d —
Cap-weighted 1d —
Momentum (drift) 1d —
Constituents in this sector

Composite Index — since inception (Dec 30, 2025)

Three weighting variants of the same constituent basket, rebased to 1,000 at inception. EW = ticker-equal-weight with quarterly drift. CW = cap-weighted (10% cap) with semi-annual rebalance. MW = drift-only (1/N at inception, market does the tilting between rebalances). Click a legend entry to toggle its line.

Constituents

Every Rubin constituent tagged into this sector. Click a row to open the stock detail page with full chart + Money-Temperature scoring.

Ticker Company Region Last 1d 1w 1m 3m 6m 1y CCY
042700.KSHanmi SemiconductorKorea219500.00-1.13%+2.81%+30.97%-24.96%+4.85%+136.75%KRW
0522.HKASMPTAsia-other160.90-2.90%-0.49%+19.10%-17.06%+44.18%+141.23%HKD
NDSNNordsonUS324.59-1.89%-2.30%+9.94%+12.97%+10.96%+45.31%USD
BESI.ASBESIEurope197.50+1.28%-7.19%+0.00%-30.99%+5.44%+85.92%EUR
LPK.DELPKF Laser & ElectronicsEurope13.20-4.35%+1.15%-7.04%-44.77%+81.57%+66.88%EUR
KLICKulicke & SoffaUS81.03-4.30%-5.50%-8.25%-20.47%+16.59%+118.12%USD

FAQ · from the current data · as of 2026-08-28

Advanced Packaging & Bonding — data Q&A

What is the Advanced Packaging & Bonding sub-index of the Rubin Build-Out 100?

6 constituents, listed across Europe, Asia-other, Korea, US, computed equal-weight, cap-weight and momentum-weight from the same basket and rebased to 1,000 at the index base date. Part of the Rubin Build-Out 100 — /indices/rubin/.

Which Advanced Packaging & Bonding constituents lead and lag over one month?

As of 2026-08-28: leading — Hanmi Semiconductor (042700.KS) +30.97%; ASMPT (0522.HK) +19.10%; Nordson (NDSN) +9.94%. Lagging — Kulicke & Soffa (KLIC) -8.25%; LPKF Laser & Electronics (LPK.DE) -7.04%; BESI (BESI.AS) +0.00%. Returns are close-to-close in each name's trading currency.

Which Advanced Packaging & Bonding names have done best over one year?

As of 2026-08-28: ASMPT (0522.HK) +141.23%; Hanmi Semiconductor (042700.KS) +136.75%; Kulicke & Soffa (KLIC) +118.12%. Weakest: Nordson (NDSN) +45.31%; LPKF Laser & Electronics (LPK.DE) +66.88%; BESI (BESI.AS) +85.92%.

How often does this sub-index update, and is it advice?

The worker recomputes the sub-index and every constituent's returns after each US close (prices converted to USD for the index level; per-name returns stay in local currency). This page is a data surface in an investment research diary — it describes constituents and returns, it recommends nothing.